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IEC 91/691/NP
Proposal from Chinese NC: Future IEC 61249-2-41: Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 91/692/NP
Proposal from Chinese NC: Future IEC 61249-2-42: Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass resinforced laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 91/757/NP
(Future IEC 61249-2-40): Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High Performance, modified, non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 91/758/NP
(Future IEC 61249-4-18): Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC 91/759/NP
(Future IEC 61249-4-19): Materials for printed boards and other interconnecting structures - Part 4-19:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC 91/805/NP
Future IEC 61189-2-628 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis (DMA; bend and pull)
IEC 91/663/CDV
NP-CDV: IEC 61249-4-14, Ed. 1: Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC/TC 91
Electronics assembly technology
ISO/TC 160/WG 5
Assembly rules and structural sealant glazing
CEN/TC 129/WG 12
Glass in building - Assembly rules