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Information technology - Open systems interconnection - Part 4: The Directory: Procedures for distributed operation - Amendment 1

Information technology - Open systems interconnection - Part 3: The Directory: Abstract service definition - Amendment 1

Information technology - Open systems interconnection - Part 2: The Directory: Models - Amendment 2

Information technology - Open systems interconnection - Part 9: The Directory: Replication - Amendment 1

Information technology - Open systems interconnection - Part 7: The Directory: Selected object classes - Amendment 1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 3-303: Test methods for interconnection structures (circuit boards) - Etch factor measurement for traces on circuit boards

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 91/1786/CD:2022); Text in German and English

Electrical accessories - Cord sets and interconnection cord sets (IEC 23G/466/CD:2021); Text in German and English

Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices

Information technology - Open systems interconnection - Part 8: The Directory: Public-key and attribute certificate frameworks - Amendment 1

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