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DIN EN IEC 60747-15
Semiconductor devices - Part 15: Discrete devices - Isolated power semiconductor devices (IEC 47E/812/CDV:2023); German and English version prEN IEC 60747-15:2023
DIN EN IEC 60747-16-9
Semiconductor devices - Part 16-9: Microwave integrated circuits - Phase shifters (IEC 47E/768/CD:2021); Text in German and English
DIN EN IEC 60747-16-11
Semiconductor devices - Part 16-11: Microwave integrated circuits - Detectors
DIN EN IEC 60749-7
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
DIN EN IEC 60749-20-1
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018
DIN EN IEC 60749-21
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
DIN EN IEC 60749-22-1
Semiconductor devices - Mechanical and climatic test methods - Part 22-1: Bond strength - wire bond pull test methods
DIN EN IEC 60749-22-2
Semiconductor devices - Mechanical and climatic test methods - Part 22-2: Bond strength - Wire bond shear test methods
DIN EN IEC 60749-24
Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
DIN EN IEC 60749-26
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
