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IEC 47D/540/NP
Proposed new package outline, Plastic, small outline family, 1,27 mm pitch, 7,5 mm body width and 14, 16, 18, 20, 24 and 28 lead counts
IEC 47D/543/NP
Proposed new package outline, Plastic small outline family, 25 mil pitch, 150 mil body width, 14, 16, 18, 20, 24 and 28 leads
IEC 47F/91/NP
Future IEC 62047-20: Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes
IEC 55/1243/CD
IEC 60317-20 Ed. 3.0: Specifications for particular types of winding wires. Part 20: Solderable polyurethane enamelled round copper wire, class 155
IEC 55/1243A/CD
IEC 60317-20 Ed. 3.0: Specifications for particular types of winding wires. Part 20: Solderable polyurethane enamelled round copper wire, class 155
IEC 55/1304/CDV
IEC 60317-20/Ed3: Specifications for particular types of winding wires - Part 20: Solderable polyurethane enamelled round copper wire, class 155
IEC 68/373A/CD
Amendment 1 to IEC 60404-6 Ed. 2.0: Magnetic materials - Part 6: Methods of measurement of the magnetic properties of magnetically soft metallic and powder materials at frequencies in the range of 20 Hz to 200 kHz by use of ring specimens
IEC 77B/316/DC
Document: CISPR/A/308/CD: IEC 61000-4-20: Electromagnetic Compatibility (EMC), Part 4: Testing and measurement techniques; Section 20: Emission and immunity testing in transverse electromagnetic (TEM) waveguides
IEC 86B/3075/CDV
IEC 61754-20 Ed. 2.0: Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 20: Type LC connector family
IEC 100/127/NP
Proposal of the US NC: Colour measurement and management in multimedia systems and equipment - Part 2-0: Colour management in multimedia systems