Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA)

(Future IEC 60191-6-22 Ed.1): Mechanical Standardization of Semiconductor Devices - Part 6-22: General rules for thepreparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

IEC 60191-6-12 Ed.2: Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA)

IEC 61188-5-7 Design and use of printed boards and printed board assemblies - Part 5-7: Sectional requirements attachment (land/joint) considerations - components with post mounting leads on two sides (dips)

Gaseous hydrogen land vehicle refuelling connection devices - Part 2: Part 2: Flow capacities greater than 120 g/s

Oil and gas industries including lower carbon energy - Pipeline transportation systems - On-land pipeline repair

Liquid Hydrogen Land Vehicle Fueling Protocol

Tyre classification - Agricultural, forestry and construction machines

Oil and gas industries including lower carbon energy - Cathodic protection of pipeline transportation systems - Part 1: On-land pipelines

Gaseous hydrogen land vehicle refuelling connection devices - Part 1: Flow capacities up to and including 120 g/s