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IEC 31/1046/CDV
IEC 60079-18/Ed4: Explosive atmospheres - Part 18: Equipment protection by encapsulation "m"
IEC 34D/987/CDV
IEC 60598-2-18 Amendment 1: Luminaires - Part 2: Particular requirements - Section 18: Luminaires for swimming pools and similar applications
IEC 40/954/FDIS
Amendment No. 1 to IEC 60384-18-2: Part 18: Blank detail specification: Fixed aluminium electrolytic chip capacitors with non-solid electrolyte. Assessment level E
IEC 40/1613/CD
IEC 60384-18: FIXED CAPACITORS FOR USE IN ELECTRONIC EQUIPMENT - Part 18: Sectional specification - Fixed aluminium electrolytic surface mount capacitors with solid (MnO2) and non-solid electrolyte
IEC 47D/540/NP
Proposed new package outline, Plastic, small outline family, 1,27 mm pitch, 7,5 mm body width and 14, 16, 18, 20, 24 and 28 lead counts
IEC 47D/543/NP
Proposed new package outline, Plastic small outline family, 25 mil pitch, 150 mil body width, 14, 16, 18, 20, 24 and 28 leads
IEC 47D/674/NP
Proposal of USNC: Proposed new package outline - 13 Pin reduced size MultiMediaCard (MMC) outline MMCmobile 18×24×1,4 mm (Intended to become IEC 60191-2/F65, if approved)
IEC 47F/47/NP
(Future IEC 62047-18): Semiconductor devices - Micro-electromechanical devices - Part 18: Micro electro mechanical devises - Bending test methods of thin film materials
IEC 47F/155/FDIS
IEC 62047-18 Ed. 1: Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
IEC 57/1093/DC
Draft IEC TR 61850-7-510: Communication networks and systems for power utility automation - Part 7-510: Hydroelectric power plants - Modelling concepts and guidelines (developed by WG 18: Hydropower plants, communication for monitoring and control)