Detail Specification for Right-angled Optical Board Connector using Glass Fibers

Future IEC 61193-3: Quality Assessment Systems - Part 3: Selection and use of sampling plans for Printed Board and Laminate end-product and in-process auditing

Future IEC 61189-2-628 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis (DMA; bend and pull)

Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-716: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz)

Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz)

IEC 61193-3, Ed. 1: Quality Assessment Systems - Part 3: Selection and use of sampling plans for Printed Board and Laminate end-product and in-process auditing

IEC 61182-2-2: Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

Future IEC 62688 Ed.1: Electronic circuit board for high-brightness LEDs

Future IEC 62689 Ed.1: Test methods for electronic circuit board for high-brightness LEDs

Future 61189-2-629: Test method of adhasion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application