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IEC 47/1449/PAS
EIA/JESD22-B116 - Wire bond shear test method
IEC 47/1906/NP
Proposal of the Korean NC: (Future IEC 62047-8): Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
IEC 47A/845/DC
Proposed corrigendum to IEC 61967-6 Ed1.1 Consol. with am1: Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
IEC 47A/862/CD
IEC 62132-6 Ed.1: Integrated circuits - Measurement ofelectromagnetic immunity - Part 6: Local Injection Horn Antenna (LIHA) method
IEC 47A/863/CDV
IEC 62132-8 Ed.1: Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC Stripline method
IEC 47A/881/CDV
IEC 62215-3 Ed.1: Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method
IEC 47C/145/CDV
Measuring method for carrier to noise ratio an analogue laser
IEC 47D/252/NP
Proposal of the Japanese NC: BGA (Ball Grid Array) package measuring method
IEC 47E/299/NP
(Future IEC 60747-14-6): Semiconductor devices - Discrete Devices - Part 14-6: Semiconductor sensors Test method of CMOS imagesensor module
IEC 47E/328/NP
(Future IEC 60747-14-x): Semiconductor devices - Discrete devices - Part 14-x: Semiconductor sensors - Test method of CMOS image sensor module
