Search results
Search list
Results in:
IEC 47F/5/NP
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (Future IEC 62047-11)
IEC 87/413/NP
New Work Item Proposal on Piezoceramic transducers - Measurement method of piezoelectric strain at large-amplitude operation
IEC 78/881/CD
IEC 61472 Ed.3: Live working - minimum approach distances for ac systems in the voltage range 72,5 kv to 800 kv - a method of calculation
IEC 78/873/DC
Relevance for TC78 to prepare a standard on a method of calculation of minimum approach distances for AC systems at medium voltages
IEC 49/938/NP
Guide to measurement method of nonilinearity for surface acoustic wave (SAW) and bulk acoustic wave (BAW) devices in radio frequency (RF)
IEC 91/1000/NP
Future 61189-2-629: Test method of adhasion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application
IEC 101/334/CDV
IEC 61340-4-10 Ed.1: Test method for the protection of electrostatic discharge susceptible Items - Two-point resistance measurement
IEC 46A/1061/CD
IEC 61726/Ed.2: Cable assemblies, cables, connectors and passive microwave components - screening attenuation measurement by the reverberation chamber method.
IEC 47F/106/NP
Future IEC 62047-15: Semiconductor devices Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass
IEC 47F/95/NP
Future IEC 62047-21: Semiconductor devices - Micro-electromechanical devices Part 21: Test method for Poisson's ratio of thin film MEMS materials
