Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-805: X/Y CTE Test for Thin Base Materials by TMA (IEC 91/1696/CD:2020); Text in German and English

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/Y Coefficient of Thermal Expansion Test (CTE) for Thick Base Materials by TMA (IEC 91/1747/CD:2021); Text in German and English

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-804: Test methods for time to delamination - T260, T288, T300 (IEC 61189-2-804:2023); German version EN IEC 61189-2-804:2023