(Future IEC 61249-2-39): Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - Modified epoxide and non-epoxide, woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

(Future IEC 61249-2-40): Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High Performance, modified, non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

(Future IEC 61249-4-18): Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

(Future IEC 61249-4-19): Materials for printed boards and other interconnecting structures - Part 4-19:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Future IEC 61189-2-628 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis (DMA; bend and pull)

Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-716: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz)

Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz)

IEC 61182-2-2: Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

IEC 60194 Ed.6: Printed board design, manufacture and assembly - Terms and definitions

Interoperability of Formats and Schemas used for Electronic Assembly Material Declaration