NP-PAS: Measuring Whisker Growth on Tin and Tin Alloy Surface Finishes (JESD22A121)

NP-CD: (Future IEC 60191-6-14): General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

NP-CD: IEC 60191-6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

NP-PAS: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

(Future IEC 60191-6-22 Ed.1): Mechanical Standardization of Semiconductor Devices - Part 6-22: General rules for thepreparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Standards for the measurement of surface mounted quartz crystal units

Proposal of the Japanese NC: Standard for the Test-fixture of Surface Mounting Quartz Crystal Units

Proposal of the Japanese NC: Standard to the Test-fixture with load-capacitance of Surface Mounting Quartz Crystal Units

Proposal of Japanese NC: Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) duplexers - Part 2: Guide to the use

Proposal of JPNC: Surface acoustic wave oscillators of assessed quality - Part 1: Generic specification