Search results
Search list
Results in:
NA 060-09-50-01 AK
Chip and dust extraction systems
DIN 8589-11
Chip removal manufacturing processes - Part 11: Grinding with rotating tool - Classification, subdivision, terms and definitions
DIN EN 63011-1
Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions (IEC 47A/996/CD:2016)
IEC 40/1119/CD
Amendment 2 to IEC 60384-10 (1989): Fixed capacitors for use in electronic equipment - Part 10: Sectional specification: Fixed multilayer ceramic chip capacitors
IEC 40/2054/CDV
IEC 60115-8-1 Ed.2: Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification - Fixed chip resistors - Assessment level E
IEC 40/954/FDIS
Amendment No. 1 to IEC 60384-18-2: Part 18: Blank detail specification: Fixed aluminium electrolytic chip capacitors with non-solid electrolyte. Assessment level E
DIN EN IEC 63287-3
Semiconductor devices - Generic semiconductor qualification guidelines - Part 3: Guidelines for reliability qualification plans for power semiconductor module
DIN EN IEC 60749-28
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (IEC 60749-28:2022); German version EN IEC 60749-28:2022
