IEC 60320-2-5: Appliance couplers for household and similar general purposes - Part 2-5: Direct interconnection couplers

IEC 61162-450 Ed.1: Maritime navigation and radiocommunication equipment and systems - Digital interfaces - Part 450: Multiple talkers and multiple listeners - Ethernet interconnection

IEC 61189-11 Ed.1: Test methods for electrical materials,interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys

IEC 61249-1-1: Materials for printed boards and other interconnection structures - Part 1-1: Safety certification of base materials for rigid printed circuit boards

Future IEC 61189-12: Test methods for electrical materials, interconnection structures and assemblies, Part-12 Erosion test method on the materials of solder bath or parts which contact with molten lead free solder.

Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-716: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz)

Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz)

Proposal of the Secretary: Future IEC 61607: Application of optical fibre links for the interconnection of audio, video and control signals in audio, video and audio-visual systems - Part 1: General - Part 2: Digital audio signals

Future IEC 61189-2-628 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis (DMA; bend and pull)