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IEC 91/756/NP
(Future IEC 61249-2-39): Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - Modified epoxide and non-epoxide, woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 91/757/NP
(Future IEC 61249-2-40): Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High Performance, modified, non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 91/758/NP
(Future IEC 61249-4-18): Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC 91/759/NP
(Future IEC 61249-4-19): Materials for printed boards and other interconnecting structures - Part 4-19:Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
IEC 91/805/NP
Future IEC 61189-2-628 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis (DMA; bend and pull)
IEC 91/806/NP
Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-716: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz)
IEC 91/807/NP
Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz)
IEC 91/860/CD
(Future IEC 61188-8-1): Component shape data specification for CAD library - Part 8-1 Generic Descriptions of the 2D and 3D description
IEC 91/894A/NP
Future IEC 62326-14: Printed boards - Device Embedded Substrate - Terminology / Reliability / Design Guide
IEC 91/902A/NP
Future IEC 61189-12: Test methods for electrical materials, interconnection structures and assemblies, Part-12 Erosion test method on the materials of solder bath or parts which contact with molten lead free solder.