IEC 61249-2-39 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - Modified epoxide and non-epoxide, woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

IEC 61249-2-40 Ed.1: Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials clad and unclad - High Performance, modified, non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

IEC 61249-4-18: Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

IEC 61249-4-19: Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Connectors for electrical and electronic equipment - Part 7: Detail specification for up to 7 ways including PE or FE (data/power) and shield pin, free and fixed circular connectors for balanced single-pair data transmission with current-carrying capacity - Mechanical mating information, pin assignment and additional requirements for type 7 (IEC 63171-7:2023)