Search results
Search list
Results in:
DIN EN 1999-1-1/NA
National Annex to DIN EN 1999-1-1:2024-11 - Eurocode 9 - Design of aluminium structures - Part 1-1: General rules
prEN 50491-5-2
General requirements for Home and Building Electronic Systems (HBES) and Building Automation and Control Systems (BACS) - Part 5-2: EMC requirements for HBES/BACS (Class A) used in residential, commercial and light industry environment
prEN 50491-5-3
General requirements for Home and Building Electronic Systems (HBES) and Building Automation and Control Systems (BACS) - Part 5-2: EMC requirements for HBES/BACS used in residential, commercial and light industry environment
IEC 31/921/FDIS
IEC 60079-35-1 Ed. 1.0: Explosive atmospheres - Part 35-1: Caplights for use in mines susceptible to firedamp - General requirements - Construction and testing in relation to the risk of explosion
IEC 47D/804/CDV
IEC 60191-6-1 Ed.2: Mechanical Standardization Of Semiconductor Devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages-Design guide for gull-wing lead terminals
IEC 47D/784/CDV
IEC 60191-6-12 Ed.2: Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA)
IEC 47D/829/FDIS
IEC 60191-6-5 Ed.2: Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
DIN EN 60512-1-4/A1
Electromechanical components for electronic equipment Basic testing procedures and measuring methods Part 1: General Section 4: Test 1d: Contact protection effectiveness (scoop-proof), Corrigendum to IEC 60512-1-4 (IEC 48B/913/DC:2000)
IEC 47D/533/CD
IEC 60191-6-9, Ed.2: Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawing of surface mounted semiconductor device packages Design Guideline for Plastic Quad Flat Package (P-QFP)
DIN EN IEC 62788-6-2
Measurement procedures for materials used in photovoltaic modules - Part 6-2: General tests - Moisture permeation testing of polymeric materials (IEC 62788-6-2:2020); English version EN IEC 62788-6-2:2020