Tape Ball Grid Array package, 0.6 mm ball diameter family (Intended for inclusion in 60191-2)

REPLACEMENT OF Document 47D/314/CD: Tape ball grid array package, 0,6 mm ball diameter family

REPLACEMENT OF Document 47D/316/CD: Proposal for 60 and 90 pin P-FBGA (Plastic Fine pitch Ball Grid Array), 0,8 mm pitch

Design guide for semiconductor packages - Ball Grid Array Package (BGA)

Design Guide for Stacked Packages and Individual Stackable packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array Packages (FBGA/FLGA)

NP-PAS: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

(Future IEC 60191-6-22 Ed.1): Mechanical Standardization of Semiconductor Devices - Part 6-22: General rules for thepreparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

IEC 60191-6-12 Ed.2: Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA)

IEC 60191-6-5 Ed.2: Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Concentrator Photovoltaic (CPV) Module, Array and Assembly: Energy Rating by Measurement