Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)

Proposal of the Japanese NC: The individual standard for 32&48 pins plastic fine pitch ball grid array (P-FBGA), 0,8 mm terminal pitch (Intended for inclusion into IEC 191-2)

Proposal of the Japanese NC: The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)

REPLACEMENT OF Document 47D/316/CD: Proposal for 60 and 90 pin P-FBGA (Plastic Fine pitch Ball Grid Array), 0,8 mm pitch

Proposal of USNC: Proposed new package outline - 13 Pin reduced size MultiMediaCard (MMC) outline MMCmobile 18×24×1,4 mm (Intended to become IEC 60191-2/F65, if approved)

Proposed new package outline - 10 pin micro size Multimedia Card (MMC) outline MMCmicro 14×12×1,1 mm (Intended to become IEC 60191-2/F66, if approved)

Proposed new package outline - 13 Pin full size Multimedia Card (MMC) Outline MMCplus 32×24×1,4 mm (Intended to become IEC 60191-2/F67, if approved)

IEC 60191-2/F63/Ed. 1: Proposed new package outline - Power Package with 34 Pins (to be published as Outline 181E)

IEC TS 62450 Ed. 1.0: Technical Specification for 40 pin SCA 2 connector with parallel selection

IEC 61300-3-46 Ed. 1.0: Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-46: Measurement of Guide Pin Bore Diameter in MT Ferrules