CORRIGENDUM to document 86C/263/NP: Proposal of the Secretariat: Proposed IEC 61282-6: TR3 Guideline for the Skew Design in Parallel Optical Interconnection Systems

IEC 61249-1-1: Materials for printed boards and other interconnection structures - Part 1-1: Safety certification of base materials for rigid printed circuit boards

Future IEC 61189-2-628 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis (DMA; bend and pull)

Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-716: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz)

Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz)

Future IEC 61189-12: Test methods for electrical materials, interconnection structures and assemblies, Part-12 Erosion test method on the materials of solder bath or parts which contact with molten lead free solder.

IEC 61189-11 Ed.1: Test methods for electrical materials,interconnection structures and assemblies - Part 11: Measurement of melting temperature and melting temperature ranges of solder alloys

Proposal of the Secretary: Future IEC 61607: Application of optical fibre links for the interconnection of audio, video and control signals in audio, video and audio-visual systems - Part 1: General - Part 2: Digital audio signals

Information technology - Interconnection of information technology equipment - Home electronic system - Architecture - ITopHome for HES Class 1 - Part z-1: Core protocol & Part z-2: Device description file (based on SJ/T 11314 & SJ/T 11317)