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IEC 91/1083/CD
IEC 62326-18 Ed.1: Printed boards - Part 18: Standard on Device Embedded Substrate - Test methods
ISO/AWI 4825-2
Fine ceramics (advanced ceramics, advanced technical ceramics) --Test method for thermal property measurements of metalized ceramic substrates - Part 2: Evaluation of heat transfer characteristics for metalized ceramics substrate for power modules
ISO/DIS 10545-23
Ceramic tiles - Part 23: Determination of elastic modulus for substrates and glaze layer
ISO/TS 16774-6
Test methods for repair materials for water-leakage cracks in underground concrete structures - Part 6: Test method for response to the substrate movement
IEC/TC 91/WG 6
Printed boards - Device Embedded Substrate - Terminology / Reliability /Design Guide
CEN/TC 223
Soil improvers and growing media
NA 057-03-01 AA
Soil improvers and growing media
CEN/TC 193/SC 1/WG 14
Testing and requirements for hardwood bonding and chemically modified wood substrates
ISO/TC 35/SC 12
Preparation of steel substrates before application of paints and related products
DIN ISO 813-2
Rubber, vulcanized or thermoplastic - Determination of adhesion to a rigid substrate - Part 2: Adhesion of a soft thermoplastic elastomer layer (ISO 813-2:2024)