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IEC 62326-18 Ed.1: Printed boards - Part 18: Standard on Device Embedded Substrate - Test methods

Fine ceramics (advanced ceramics, advanced technical ceramics) --Test method for thermal property measurements of metalized ceramic substrates - Part 2: Evaluation of heat transfer characteristics for metalized ceramics substrate for power modules

Ceramic tiles - Part 23: Determination of elastic modulus for substrates and glaze layer

Test methods for repair materials for water-leakage cracks in underground concrete structures - Part 6: Test method for response to the substrate movement

Committees

IEC/TC 91/WG 6

Printed boards - Device Embedded Substrate - Terminology / Reliability /Design Guide

Committees

CEN/TC 223

Soil improvers and growing media

Soil improvers and growing media

Testing and requirements for hardwood bonding and chemically modified wood substrates

Preparation of steel substrates before application of paints and related products

Rubber, vulcanized or thermoplastic - Determination of adhesion to a rigid substrate - Part 2: Adhesion of a soft thermoplastic elastomer layer (ISO 813-2:2024)

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