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IEC 47D/677/NP
NP-PAS: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
IEC 47D/782/NP
(Future IEC 60191-6-22 Ed.1): Mechanical Standardization of Semiconductor Devices - Part 6-22: General rules for thepreparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
IEC 47D/829/FDIS
IEC 60191-6-5 Ed.2: Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
IEC 89/123/DIS
IEC 695-10-2: Fire hazard testing - Part 10: Test methods - Section 2: Method for testing products made from non-metallic materials for resistance to heat using the ball pressure test
ISO/CD 26622-3
Modular taper interface with ball track system - Part 3: Part 3: Dimensions of shanks, four locking elements
ISO/CD 26622-4
Modular taper interface with ball track system - Part 4: Part 4: Dimensions ofreceivers, four locking elements
prEN 60191-2
Mechanical standardization for semiconductor devices - Part 2: Dimensions - Pin plastic fine pitch ball grid array package (P-FBGA) family for memory
NA 005-01-27 AA
Sports halls; safety against ball throwing and impact protection surface systems for walls
DIN EN 00217138
Surfaces for sports areas - Determination of ball roll behaviour
DIN 18032-3/A1
Sports halls - Halls and rooms for sports and multi-purpose use - Part 3: Testing of safety against ball throwing; Amendment A1
