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IEC 47F/38/NP
(Future IEC 62047-15): Semiconductor devices -Micro-electromechanical devices - Part 15: Test method for bond strength in PDMS/Glass chip
IEC/TC 40/MT 60384-23
Part 23:Fixed metallized polyethylene naphthalate film dielectric chip d.c. capacitors
NA 176-09-03 AA
Organ on Chip
SECT/FG OOC
CEN-CLC/FG on Organ-On-Chip
ISO/IEC JTC 1/SC 17/WG 4
Generic interfaces and protocols for security devices
CLC/TC 47X
Semiconductor devices and trusted chips
ISO/IEC JTC 1/SC 17/WG 8
Integrated circuit cards without contacts
NA 043-04-17-04 UA
Exchange protocols for integrated circuit cards
ISO/IEC JTC 1/SC 17/WG 11
Application of biometrics to cards and personal identification
CEN/TC 142/WG 10
Chip and dust extraction systems
