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IEC 47/1987/DC
Maintenance of IEC 60747-1 Ed. 2.0: Semiconductor devices - Part 1: General
IEC 47C/173/FDIS
Amendment 3 to IEC 60747-5: Semiconductor devices - Discrete devices and integrated circuits - Part 5: Optoelectronic devices
IEC 47D/782/NP
(Future IEC 60191-6-22 Ed.1): Mechanical Standardization of Semiconductor Devices - Part 6-22: General rules for thepreparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
IEC 47E/119/CDV
IEC 60747-4: Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors - Integrated circuit microwave frequency prescalers
IEC 47E/179/NP
Semiconductor devices, Discrete devices, Semiconductor Flow Sensor
IEC 47E/200/FDIS
IEC 60747-16-1, Ed.1: Semiconductor devices, Part 16-1: Microwave integrated circuits - Amplifiers
IEC 47E/293/NP
(Future IEC 60747-14-5): Discrete semiconductor devices - Part 14-5: Semiconductor sensors - PN-junction semiconductor temperature sensor
IEC 47E/297/NP
(Future IEC 60747-16-5): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
IEC 47E/299/NP
(Future IEC 60747-14-6): Semiconductor devices - Discrete Devices - Part 14-6: Semiconductor sensors Test method of CMOS imagesensor module
IEC 47E/312/NP
(Future IEC 60747-16-5): Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
