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IEC/TC 8/WG 8
To define a general framework and procedures for maintenance of electrical energy supply networks
IEC/TC 8/MT 8
To define a general framework and procedures for maintenance of electrical energy supply networks
IEC CIS/H/167/DC
Adopting the full approach for measurement instrumentation uncertainty as defined in CISPR 16-4-2 ed. 1.0 in future revisions of IEC 61000-6-3 and IEC 61000-6-4
IEC 77B/560/DC
Interpretation of the amplifier saturation check as defined in IEC 61000-4-3 Ed. 3.0: Electromagnetic compatibility (EMC) - Part 4-3 : Testing and measurement techniques - Radiated, radio-frequency, electromagnetic field immunity test
IEC 91/755/NP
(Future IEC 61249-2-30): Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
IEC 17B/1821/FDIS
IEC 60947-5-3 Ed.2: Low-voltage switchgear and controlgear - Part 5-3: Control circuit devices and switching elements - Requirements for proximity devices with defined behaviour under fault conditions (PDDB)
IEC 91/596/NP
IEC 61249-2-36: Materials for printed boards and other interconnecting structures - Part 2-36: Sectional specification set for reinforced based materials, clad and unclad - Epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly
IEC 91/754/NP
(Future IEC 61249-2-27): Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
IEC 91/756/NP
(Future IEC 61249-2-39): Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - Modified epoxide and non-epoxide, woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
IEC 91/563/NP
Future IEC 61249-2-35: Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly