High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor (IEC 51/1441/CDV:2023); German and English version prEN IEC 62024-1:2023

Endurance test methods for die attach materials applied to power electronics devices - Part 2: Temperature cycling test method and reliability performance index for Die attach materials applied to discrete type power electronic devices (IEC 91/1660/CD:2020); Text in German and English

Endurance test methods for die attach materials - Part 3: Power cycling test method for die attach materials applied to discrete type power electronic devices

Endurance test methods for die attach materials - Part 4: Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices

Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1770/CD:2021); Text in German and English

Amendment to IEC 60384-3 (1989): Fixed capacitors for equipment - Part 3: Sectional specification: Fixed tantalum chip capacitors

Amendment to IEC 60384-3-1 (1989): Fixed capacitors for equipment - Part 3-1: Blank detail specification: Fixed tantalum chip capacitors. Assessment level E

IEC/TR 62258-4 Ed.2: Semiconductor die products - Part 4: Questionnaire for die users and suppliers

IEC 62258-2 Ed.2: SEMICONDUCTOR DIE PRODUCTS - Part 2: Exchange data formats

IEC 61748: Manufacturing line approval for MCM (QML)