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PD IEC/TR 61191-8
Printed board assemblies. Voiding in solder joints of printed board assemblies for use in automotive electronic control units. Best practices
Edition
2021-03-25
BS EN 61191-6
Printed board assemblies. Evaluation criteria for voids in soldered joints of BGA and LGA and measurement methods
Edition
2010-05-31
UNE-EN 61191-6
Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method (Endorsed by AENOR in August of 2010.)
Edition
2010-08-01
BS 3338-7
Methods for the sampling and analysis of tin and tin alloys. Method for the determination of silver in solders (volumetric: ammonium thiocyanate method)
Edition
1961-02-17
BS 3338-11
Methods for the sampling and analysis of tin and tin alloys. Method for the determination of tin in solders (nickel coil reduction method)
Edition
1961-02-17
BS 3338-13
Methods for the sampling and analysis of tin and tin alloys. Method for the determination of antimony in solders and white metal bearing alloys (volumetric: potassium bromate method)
Edition
1965-03-18
BS 3338-18
Methods for the sampling and analysis of tin and tin alloys. Method for the determination of aluminium in solders and white metal bearing alloys (photometric method)
Edition
1966-07-28
BS 3338-19
Methods for the sampling and analysis of tin and tin alloys. Method for the determination of zinc in solders and white metal bearing alloys (photometric method)
Edition
1966-07-28
BS 3338-17
Methods for the sampling and analysis of tin and tin alloys. Method for the determination of cadmium in solders and white metal bearing alloys (photometric method)
Edition
1965-03-18
NF C90-708 ; NF EN 61191-6:2010-07-01
Printed board assemblies - Part 6: evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
Edition
2010-07-01
