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Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
Edition 2013-08-12

Standards [CURRENT]

IPC J-STD-006C AMD 1

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications; Amendment 1
Edition 2017-10-01

Standards [CURRENT]

PD IEC/TR 61760-3-1

Surface mounting technology. Standard method for the specification of components for through hole reflow (THR) soldering. Guidelines for through hole diameter design with solder paste surface printing method
Edition 2022-09-30

Standards [CURRENT]

UNE-EN IEC 61189-5-301

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (Endorsed by Asociación Española de Normalización in June of 2021.)
Edition 2021-06-01

Standards [CURRENT]

UNE-EN IEC 61189-5-601

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards (Endorsed by Asociación Española de Normalización in April of 2021.)
Edition 2021-04-01

Standards [CURRENT]

UNE-EN IEC 61190-1-3

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (Endorsed by Asociación Española de Normalización in April of 2018.)
Edition 2018-04-01

Standards [CURRENT]

UNE-EN ISO 9455-10

Soft soldering fluxes - Test methods - Part 10: Flux efficacy test, solder spread method (ISO 9455-10:2012)
Edition 2012-12-26

Standards [CURRENT]

UNE-EN 60512-12-1

Connectors for electronic equipment - Tests and measurements - Part 12-1: Soldering tests - Test 12a: Solderability, wetting, solder bath method (IEC 60512-12-1:2006).
Edition 2007-02-07

Standards [CURRENT]

UNE-EN 60512-12-4

Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method (IEC 60512-12-4:2006).
Edition 2006-12-13

Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method
Edition 2007-04-25

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