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IPC 4555
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
Edition
2022-04-01
IPC EIA/JEDEC J-STD-002E ; IPC EIA/IPC/JEDEC J-STD-002E:2017-11-01
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
Edition
2017-11-01
IPC J-STD-003D
Solderability Tests for Printed Boards
Edition
2022-10-01
IPC TR-462
Solderability Evaluation of Printed Boards with Protective Coatings over a Long Term Storage
Edition
1987-10
IPC TR-464
Accelerated Aging for Solderability Evaluations
Edition
1984-04
IPC TR-464 Addendum 1
Accelerated Aging for Solderability Evaluations; Addendum
Edition
1987-04
IPC TR-465-2
Effect of Steam Aging Time and Temperature on Solderability Test Results
Edition
1993-07
IPC TR-585
Time, Temperature and Humidity Stress of Final Board Finish Solderability; no Hard Copy
Edition
2006-06-22
OVE EN IEC 60068-2-83
Environmental testing - Part 2-83: Tests - Test tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 91/1968/CDV) (english version)
Edition
2024-10-01
PR NF C20-783 ; PR NF EN IEC 60068-2-83
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
