Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
Edition 2001-07-17

Space product assurance - Qualification and Procurement of printed circuit boards; English version EN 16602-70-60:2019, only on CD-ROM
Edition 2019-10

Space product assurance - High-reliability soldering for surface mount, mixed technology and hand-mounted electrical connections; English version EN 16602-70-61:2022
Edition 2023-01

Space product assurance - Wire wrapping of high-reliability electrical connections; English version EN 16602-70-30:2014
Edition 2015-07

Space product assurance - Crimping of high-reliability electrical connections; English version EN 16602-70-26:2019
Edition 2019-07

Solderless connections - Part 2: Crimped connections - General requirements, test methods and practical guidance (IEC 48B/2889/CD:2021); Text in German and English
Edition 2023-03

Space product assurance - Design rules for printed circuit boards; English version EN 16602-70-12:2016
Edition 2016-12

Space product assurance - Commercial, electrical, electronic and electromechanical (EEE) components; English version EN 16602-60-13:2023
Edition 2023-10