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IPC TR-486
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations
Edition
2001-07-17
DIN EN 16602-60-13
Space product assurance - Commercial, electrical, electronic and electromechanical (EEE) components; English version EN 16602-60-13:2023
Edition
2023-10
DIN EN 16602-70-80
Space product assurance - Processing and quality assurance requirements for metallic powder bed fusion technologies for space applications; English version EN 16602-70-80:2021
Edition
2022-08
DIN EN 16602-70-60
Space product assurance - Qualification and Procurement of printed circuit boards; English version EN 16602-70-60:2019, only on CD-ROM
Edition
2019-10
DIN EN 16602-70-61
Space product assurance - High-reliability soldering for surface mount, mixed technology and hand-mounted electrical connections; English version EN 16602-70-61:2022
Edition
2023-01
DIN EN 16602-70-30
Space product assurance - Wire wrapping of high-reliability electrical connections; English version EN 16602-70-30:2014
Edition
2015-07
DIN EN 16602-70-26
Space product assurance - Crimping of high-reliability electrical connections; English version EN 16602-70-26:2019
Edition
2019-07
DIN EN IEC 60352-2
Solderless connections - Part 2: Crimped connections - General requirements, test methods and practical guidance (IEC 48B/2889/CD:2021); Text in German and English
Edition
2023-03
DIN EN 16602-70-12
Space product assurance - Design rules for printed circuit boards; English version EN 16602-70-12:2016
Edition
2016-12