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DIN EN 61189-5-3
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015); German version EN 61189-5-3:2015
Edition
2015-11
DIN EN 61189-5
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies (IEC 61189-5:2006); German version EN 61189-5:2006
Edition
2007-05
DIN EN IEC 61189-5-301
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (IEC 61189-5-301:2021); German version EN IEC 61189-5-301:2021
Edition
2022-08
DIN EN 60068-2-83
Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (IEC 60068-2-83:2011); German version EN 60068-2-83:2011
Edition
2012-07
DIN EN ISO 11073-10418
Health informatics - Personal health device communication - Part 10418: Device specialization - International Normalized Ratio (INR) monitor (ISO/IEEE 11073-10418:2014); English version EN ISO 11073-10418:2014
Edition
2014-06
VDI 2872 Blatt 2
Lean production systems - Lean enterprise system - Method catalog
Edition
2022-04
Mit Lean-Service-Zyklus und Entwicklung digitaler Dienstleistungssysteme zum Erfolg - Industrie 4.0
Edition
2021-04
