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CAN/CSA-ISO/IEC 15205-02
SBus - Chip and module interconnect bus
Edition
2002-12-01
IPC T-50N
Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Edition
2021-11-01
IPC SM-780
Component Packaging & Interconnecting with Emphasis on Surface Mounting
Edition
1988-03-01
IPC 2315 ; IPC/JPCA-2315:2000-11-01
Design Guide for High Density Interconnects & Microvias
Edition
2000-11-01
IPC JEDEC 9702
Monotonic Bend Characterization of Board-Level Interconnects
Edition
2015-05
IPC 4104
Specification for High Density Interconnect (HDI) and Microvia Materials
Edition
1999-05-09
IPC 4922
Requirements for Sintering Materials for Electrical and Thermal Interconnects
Edition
2024-01-01
UL 796F
Flexible materials interconnect constructions
Edition
2021-02-26
IPC JEDEC 9707 AMD 1
Spherical Bend Test Method for Characterization of Board Level Interconnects
Edition
2018-05-01
IPC JEDEC 9707
Spherical Bend Test Method for Characterization of Board Level Interconnects
Edition
2011-09-13
