Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
Edition 2002-05

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) (Endorsed by AENOR in December of 2001.)
Edition 2001-12-01

Detail Specification for Adaptor - Carrier Quad Flatpack to Pin Grid Array Sockets for Use in Electronic Equipment
Edition 1992-01-23

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
Edition 2002-06-28

Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
Edition 2001-11-16

Mechanical standardization of semiconductor devices - Part 6-8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
Edition 2002-08-01

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001)
Edition 2002-07-01

Detail Specification for Chip Carrier Sockets for Plastic Quad Flat Pack 0.635 mm (.025") Lead Spacing (Gullwing)
Edition 1991-03

Space product assurance - Repair and modification of printed circuit board assemblies for space use; English version EN 16602-70-28:2014
Edition 2015-06

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity) (IEC 60749-14:2003); German version EN 60749-14:2003
Edition 2004-07