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UNE-EN 62415
Semiconductor devices - Constant current electromigration test (Endorsed by AENOR in September of 2010.)
Edition
2010-09-01
EIA JEP 154A
Guideline for Characterizing Solder Bump Electromigration under Constant Current and Temperature Stress
Edition
2024-03
EIA JESD 61A.01
Isothermal Electromigration Test Procedure
Edition
2007-10
EIA JESD 63
Standard Method for Calculating the Electromigration Model Parameters for Current Density and Temperature
Edition
1998-02
EIA JESD 202
Method for Characterizing the Electromigration Failure Time Distribution of Interconnects Under Constant-Current and Temperature Stress
Edition
2006-03
BS EN 62415
Semiconductor devices. Constant current electromigration test
Edition
2010-07-31
NF C80-201 ; NF EN 62415:2010-11-01
Semiconductor devices - Constant current electromigration test
Edition
2010-11-01
SN EN 62415
Semiconductor devices - Constant current electromigration test
Edition
2010-06
DIN EN ISO 9455-17
Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2024); German version EN ISO 9455-17:2024
Edition
2024-04
IPC TR-476A
Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies
Edition
1984-06
