Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers (IEC 62374-1:2010); German version EN 62374-1:2010 + AC:2011
Edition 2011-06

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing (IEC 61193-3:2013); German version EN 61193-3:2013
Edition 2013-11

Fibre optic active components and devices - Package and interface standards - Part 5: SC 1x9 fibre optic modules (IEC 62148-5:2003); German version EN 62148-5:2003
Edition 2003-11

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022
Edition 2023-12

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT) (IEC 91/1700/CD:2021); Text in German and English
Edition 2022-04

Connectors for electronic equipment - Tests and measurements - Part 25-7: Test 25g - Impedance, reflection coefficient and standing voltage wave ratio (VSWR) (IEC 60512-25-7:2004); German version EN 60512-25-7:2005
Edition 2005-12

Fibre optic active components and devices - Package and interface standards - Part 3: SFF 20-pin transceivers (IEC 62148-3:2010); German version EN 62148-3:2011
Edition 2011-06

Connectors for electronic equipment - Tests and measurements - Part 23-4: Screening and filtering tests; Test 23d: Transmission line reflections in the time domain (IEC 60512-23-4:2001); German version EN 60512-23-4:2001
Edition 2002-07

Fibre optic active components and devices - Package and interface standards - Part 6: ATM-PON transceivers (IEC 62148-6:2020); German version EN IEC 62148-6:2020
Edition 2022-05

Fibre optic active components and devices - Package and interface standards - Part 2: SFF 10-pin transceivers (IEC 62148-2:2010); German version EN 62148-2:2011
Edition 2011-07