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OEVE/OENORM EN 62047-27
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) (IEC 47F/230/CDV) (english version)
Edition
2015-12-15
BS IEC 62047-27
Semiconductor devices. Micro-electromechanical devices. Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
Edition
2020-07-22
UNE-EN 14869-1
Structural adhesives - Determination of shear behaviour of structural bonds - Part 1: Torsion test method using butt-bonded hollow cylinders (ISO 11003-1:2001, modified)
Edition
2011-10-05
ASTM E 1512
Standard Test Methods for Testing Bond Performance of Bonded Anchors
Edition
2001
ABNT NBR 15049
Standard teste methods for testing bond performance of bonded anchors
Edition
2004-03-31
UNE-EN 634-2
Cement-bonded particleboards - Specifications - Part 2: Requirements for OPC bonded particleboards for use in dry, humid and external conditions
Edition
2007-07-18
AS 3862
External fusion-bonded epoxy coating for steel pipes
Edition
2020
AS/NZS 4158 AMD 1
Thermal-bonded polymeric coatings on valves and fittings for water industry purposes
Edition
2005
AS/NZS 4158
Thermal-bonded polymeric coatings on valves and fittings for water industry purposes
Edition
2003
AS EN 12413
Safety requirements for bonded abrasive products
Edition
2022
