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DIN EN 60749-1
Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003
Edition
2003-12
DIN EN 60749-4
Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017); German version EN 60749-4:2017
Edition
2017-11
DIN EN 153000
Generic specification: Discrete pressure contact power semiconductor devices (Qualification approval); German version EN 153000:1998
Edition
1999-01
DIN EN 60749-8
Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003
Edition
2003-12
DIN EN 61747-1
Liquid crystal and solid-state display devices - Part 1: Generic specification (IEC 61747-1:1998 + A1:2003); German version EN 61747-1:1999 + A1:2003
Edition
2003-12
DIN EN IEC 62239-1
Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan (IEC 62239-1:2018); German version EN IEC 62239-1:2018
Edition
2019-06
DIN EN 61163-1
Reliability stress screening - Part 1: Repairable assemblies manufactured in lots (IEC 61163-1:2006); German version EN 61163-1:2006
Edition
2007-06
DIN EN 61709
Electric components - Reliability - Reference conditions for failure rates and stress models for conversion (IEC 61709:2011); German version EN 61709:2011
Edition
2012-01
DIN EN 60286-6
Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components (IEC 60286-6:2004); German version EN 60286-6:2004
Edition
2004-10
DIN EN 61760-4
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015 + A1:2018); German version EN 61760-4:2015 + A1:2018
Edition
2018-09