Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003
Edition 2003-12

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017); German version EN 60749-4:2017
Edition 2017-11

Generic specification: Discrete pressure contact power semiconductor devices (Qualification approval); German version EN 153000:1998
Edition 1999-01

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing (IEC 60749-8:2002 + Corr. 1:2003 + Corr. 2:2003); German version EN 60749-8:2003
Edition 2003-12

Liquid crystal and solid-state display devices - Part 1: Generic specification (IEC 61747-1:1998 + A1:2003); German version EN 61747-1:1999 + A1:2003
Edition 2003-12

Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan (IEC 62239-1:2018); German version EN IEC 62239-1:2018
Edition 2019-06

Reliability stress screening - Part 1: Repairable assemblies manufactured in lots (IEC 61163-1:2006); German version EN 61163-1:2006
Edition 2007-06

Packaging of components for automatic handling - Part 6: Bulk case packaging for surface mounting components (IEC 60286-6:2004); German version EN 60286-6:2004
Edition 2004-10

Electric components - Reliability - Reference conditions for failure rates and stress models for conversion (IEC 61709:2011); German version EN 61709:2011
Edition 2012-01

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices (IEC 61760-4:2015 + A1:2018); German version EN 61760-4:2015 + A1:2018
Edition 2018-09