Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2020); German version EN IEC 60749-30:2020
Edition 2023-02

Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan (IEC 62239-1:2018); German version EN IEC 62239-1:2018
Edition 2019-06

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-502: General test methods for materials and assemblies - Surface insulation resistance (SIR) testing of assemblies (IEC 61189-5-502:2021); German version EN IEC 61189-5-502:2021
Edition 2022-05

Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 61240:2016); German version EN 61240:2017)
Edition 2017-08

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022
Edition 2023-12

Sectional specification - Waveguide type dielectric resonators; German version EN 170100:2001
Edition 2002-02

Electric components - Reliability - Reference conditions for failure rates and stress models for conversion (IEC 61709:2011); German version EN 61709:2011
Edition 2012-01

Sectional specification: Surface acoustic wave (SAW) filters; German version EN 166100:1998
Edition 1999-03

Fibre optic active components and devices - Package and interface standards - Part 12: Laser transmitters with coaxial RF connector (IEC 62148-12:2004 + AMD1:2022); German version EN 62148-12:2004 + A1:2022
Edition 2023-06

Electric components - Reliability - Reference conditions for failure rates and stress models for conversion (IEC 56/1583/CD:2014)
Edition 2015-01