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CSA ISO/IEC TR 11801-9907
Information technology - Generic cabling for customer premises - Part 9907: Specifications for direct attach cabling (Adopted ISO/IEC TR 11801-9907:2019, first edition, 2019-07)
Edition
2020-07-01
CSA ISO/IEC 14763-4
Information technology - Implementation and operation of customer premises cabling - Part 4: Measurement of end-to-end (E2E) links, modular plug terminated links (MPTLs) and direct attach cabling (Adopted ISO/IEC 14763-4:2021, edition 2.0, 2021-03)
Edition
2021-12-01
ISO/IEC TR 11801-9907
Information technology - Generic cabling systems for customer premises - Part 9907: Specifications for direct attach cabling
Edition
2019-07
ISO/IEC 14763-4 Technical Corrigendum 1
Information technology - Implementation and operation of customer premises cabling - Part 4: Measurement of end-to-end (E2E) links, modular plug terminated links (MPTLs) and direct attach cabling; Technical Corrigendum 1
Edition
2022-09
OVE EN IEC 63215-2
Endurance test methods for die attach materials - Part 2: Temperature cycling test method for die attach materials applied to discrete type power electronic devices (IEC 91/1787/CDV) (english version)
Edition
2022-07-15
OVE EN IEC 63215-5
Endurance test methods for die attach materials - Part 5: Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices (IEC 91/1810/CDV) (english version)
Edition
2022-12-15
ABNT NBR 16869-3
Structured cabling Part 3: Configurations and measurement of end-to-end links, modular plug terminated links and direct attach cabling
Edition
2022-12-21
PR NF C73-745-5 ; PR NF EN IEC 63215-5
Endurance test methods for die attach materials - Part 5: temperature cycling test methods and reliability performance index for die attach materials (system soldering interconnection) applied to module type power electronic devices
21/30439434 DC
BS EN IEC 63215-5. Endurance test methods for die attach materials. Part 5. Temperature cycling test methods for die attach materials (system soldering interconnection) applied to module type power electronic devices
Edition
2021-12-03
22/30383603 DC
BS IEC 63215-4. Endurance test methods for die attach materials applied to power electronic devices. Part 4. Power cycling test method for die attach materials (near chip interconnection) applied to module type power electronic devices
Edition
2022-12-15
