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DIN EN 62047-9
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
Edition
2012-03
DIN 51456
Testing of materials for semiconductor technology - Surface analysis of silicon wafers by multielement determination in aqueous analysis solutions using mass spectrometry with inductively coupled plasma (ICP-MS)
Edition
2013-10
DIN EN IEC 62276
Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods (IEC 49/1401/CD:2022); Text in German and English
Edition
2023-05
DIN EN 62276
Single crystal wafers for surface acoustic wave (SAW) device applications - Specifications and measuring methods (IEC 62276:2016); German version EN 62276:2016
Edition
2017-08
EIA JESD 22-B118A
Semiconductor Wafer and Die Backside External Visual Inspection
Edition
2021-11
AS 4795.1 AMD 1
Butterfly valves for waterworks purposes, Part 1: Wafer and lugged
Edition
2021
AS 4795.1 AMD 2
Butterfly valves for waterworks purposes, Part 1: Wafer and lugged
Edition
2021
AS 4795.1
Butterfly valves for waterworks purposes, Part 1: Wafer and lugged
Edition
2011
UNE-EN 62047-9
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (Endorsed by AENOR in June of 2012.)
Edition
2012-06-01
BS IEC 63068-1
Semiconductor devices. Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices. Classification of defects
Edition
2019-05-10
