Low-voltage fuses - Part 13: Semiconductor fuses (Trinational standard with UL 248-13 and NMX-J-009/248/13-2022-ANCE)
Edition 2022-03-01

Semiconductor Design Standard for Flip Chip Applications
Edition 1999-08-01

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM) (IEC 47/2155/CDV)
Edition 2013-04-15

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) (IEC 47/1751/CDV)
Edition 2004-05-01

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) (IEC 47F/230/CDV) (english version)
Edition 2015-12-15

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting (IEC 47/2214/CDV) (english version)
Edition 2015-02-15

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting (IEC 47/2229/CDV) (english version)
Edition 2015-06-15

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting (IEC 47/2232/CDV) (english version)
Edition 2015-07-15

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates (IEC 47/2256/CDV) (english version)
Edition 2016-01-15

Semiconductor die products - Part 4: Questionnaire for die users and suppliers (IEC 47/2073A/DTR)
Edition 2010-11-01