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IPC 4101EW1 ; IPC-4101E:2020-04-01 ; IPC-4101E-WAM1:2020-04-01
Specification for Base Materials for Rigid and Multilayer Printed Boards
Edition
2020-04-01
IPC 4121
Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications
Edition
2000-01-01
IPC 4811
Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
Edition
2008-05-30
IPC 4821
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
Edition
2006-06-12
IPC 4821 AMD 1
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards; Amendment 1
Edition
2010-04
IPC D-859
Design Standard for Thick Film Multilayer Hybrid Circuits
Edition
1989-12-01
IPC HM-860
Specification for Multilayer Hybrid Circuits
Edition
1987-01
IPC ML-960
Qualification and Performance Specification for Mass Lamination Panels for Multilayer printed Boards
Edition
1994-07-01
ISO 24688
Determination of modulation period of nano-multilayer coatings by low-angle X-ray methods
Edition
2022-07
ABNT NBR 16017
Plain bearings - Multilayer materials for thin-walled plain bearings
Edition
2024-06-19