Semiconductor devices - Metallization stress void test (Endorsed by AENOR in October of 2010.)
Edition 2010-10-01

Standard Method for Measuring and Using the Temperature Coefficient of Resistance to Determine the Temperature of a Metallization Line
Edition 2004-02

Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding
Edition 2017-08

Iron ores for shaft direct-reduction feedstocks. Determination of the reducibility index, final degree of reduction and degree of metallization
Edition 2015-09-30

Iron ores for shaft direct-reduction feedstocks. Determination of the low-temperature reduction-disintegration index and degree of metallization
Edition 2022-04-22

Iron ores for shaft direct-reduction feedstocks - Determination of the low-temperature reduction-disintegration index and degree of metallization
Edition 2022-03

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by Asociación Española de Normalización in May of 2018.)
Edition 2018-05-01

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) (Endorsed by AENOR in June of 2015.)
Edition 2015-06-01

Iron ores for shaft direct-reduction feedstocks - Determination of the reducibility index, final degree of reduction and degree of metallization
Edition 2021-04-19