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DIN EN IEC 60749-37
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022
Edition
2023-12
DIN EN 60749-40
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 60749-40:2011); German version EN 60749-40:2011
Edition
2012-02
OEVE/OENORM EN 60749-40
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 60749-40:2011) (german version)
Edition
2012-04-01
OVE EN IEC 60749-37
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer ((IEC 60749-37:2022) EN IEC 60749-37:2022) (german version)
Edition
2024-01-01
SN EN IEC 60749-37
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Edition
2022-11
SN EN 60749-40
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
Edition
2011-09
NF C93-707-20 ; NF EN 62326-20:2016-07-08
Printed boards - Part 20: printed circuit boards for high-brightness LEDs
Edition
2016-07-08
NF C96-022-37 ; NF EN IEC 60749-37:2022-11-18
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
Edition
2022-11-18
NF C96-022-37 ; NF EN 60749-37:2008-07-01
Semiconductor devices - Mechanical and climatic test methods - Part 37: board level drop test method using an accelerometer
Edition
2008-07-01
NF C96-022-40 ; NF EN 60749-40:2012-02-01
Semiconductor devices - Mechanical and climatic test methods - Part 40: board level drop test method using a strain gauge
Edition
2012-02-01
