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DIN EN 60749-40
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 60749-40:2011); German version EN 60749-40:2011
Edition
2012-02
VDI/VDE 2635 Blatt 1
Experimental structural analysis - Metallic bonded resistance strain gauges - Characteristics and test conditions
Edition
2024-03
VDI/VDE-MT 2636
Certification of courses and examinations in strain gauge measurement technology
Edition
2020-01
ISO 23048
Ships and marine technology - Verification method for portable power measurement using a strain gauge
Edition
2018-07
OEVE/OENORM EN 60749-40
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge (IEC 60749-40:2011) (german version)
Edition
2012-04-01
SN EN 60749-40
Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
Edition
2011-09
NF C96-022-40 ; NF EN 60749-40:2012-02-01
Semiconductor devices - Mechanical and climatic test methods - Part 40: board level drop test method using a strain gauge
Edition
2012-02-01
BS 6888
Methods for calibration of bonded electrical resistance strain gauges
Edition
1988-09-30
BS EN 60749-40
Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using a strain gauge
Edition
2011-09-30
ASTM E 1237
Standard Guide for Installing Bonded Resistance Strain Gages
Edition
2020
