Standard Specification for Aluminum Powder and Paste Pigments for Paints
Edition 1981

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste (Endorsed by AENOR in January of 2012.)
Edition 2012-01-01

Attachment materials for electronic assembly. Requirements for soldering pastes for high-quality interconnects in electronics assembly
Edition 2014-06-30

Environmental testing. Tests. Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Edition 2011-11-30

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles (Endorsed by Asociación Española de Normalización in June of 2021.)
Edition 2021-06-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (Endorsed by AENOR in April of 2015.)
Edition 2015-04-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste using fine solder particles
Edition 2021-05-06

Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods for materials and assemblies. Soldering paste for printed board assemblies
Edition 2015-01-31

Standard Practice for Working Life of Liquid or Paste Adhesives by Consistency and Bond Strength
Edition 1999

Carbonaceous materials used in the production of aluminium - Cold and tepid ramming pastes - Determination of rammability of unbaked pastes
Edition 2004-07