Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
Edition 2014-04

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
Edition 2013-08

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
Edition 2011-03

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
Edition 2011-03

Household and similar electrical appliances - Test code for the determination of airborne acoustical noise - Part 2-8: Particular requirements for electric shavers, hair clippers or trimmers (IEC 60704-2-8:2020); German version EN IEC 60704-2-8:2020
Edition 2020-12

Bituminous mixtures - Test methods - Part 13: Temperature measurement; German version EN 12697-13:2017
Edition 2018-01

Ceramic tiles - Part 13: Determination of chemical resistance (ISO 10545-13:2016); German version EN ISO 10545-13:2016
Edition 2017-04

Non-alloy steel wire rod for conversion to wire - Part 2: Specific requirements for general purpose wire rod (ISO 16120-2:2017); German version EN ISO 16120-2:2017
Edition 2017-06

LED packages for general lighting - Specification sheet (IEC 63146:2019); German version EN IEC 63146:2019
Edition 2020-08

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning (IEC 61189-2-630:2018); German version EN IEC 61189-2-630:2018
Edition 2019-03