Search results
Search list
Results in:
DIN IEC/TS 62647-2 ; DIN SPEC 42647-2:2013-09
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin (IEC/TS 62647-2:2012)
Edition
2013-09
BS 4584-103.2
Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for copper foil for use in the manufacture of copper-clad base materials
Edition
1990-02-28
NF C93-781 ; NF EN 61249-5-1:1996-09-01
Materials for interconnection structures. Part 5: sectional specification set for conductive foils and films with and without coatings. Section 1 : copper foils (for the manufacture of copper-clad base materials)
Edition
1996-09-01
SN EN 61249-5-1
Materials for interconnection structures. Part 5: Sectional specification set for conductive foils and films with and without coatings. Section 1: Copper foils (for the manufacture of copper-clad base materials)
Edition
1996-01
UNE-EN 61249-5-1
MATERIALS FOR INTERCONNECTION STRUCTURES. PART 5: SECTIONAL SPECIFICATION SET FOR CONDUCTIVE FOILS AND FILMS WITH AND WITHOUT COATINGS. SECTION 1: COPPER FOILS (FOR THE MANUFACTURE OF COPPER-CLAD BASE MATERIALS).
Edition
1997-07-15
VDI/VDE 2183
Reliable operation of Ethernet-based bus systems in industrial automation
Edition
2018-01
VDI 2102 Blatt 2
Emission control - Copper and copper alloy melting plants
Edition
2013-04
Quality Management
QM systems, procedures and terminology
Edition
2021-04
Holzspielplätze
Planung, Schutz, Wartung und Schäden
Edition
2023-11
