Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (IEC 60191-6-19:2010); German version EN 60191-6-19:2010
Edition 2010-10

Manufacturing processes joining - Part 0: General; Classification, subdivision, terms and definitions
Edition 2003-09

Connectors for electronic equipment - Tests and measurements - Part 13-5: Mechanical operation tests - Test 13e: Polarizing and keying method (IEC 60512-13-5:2006); German version EN 60512-13-5:2006
Edition 2006-11

Connectors for electronic equipment - Tests and measurements - Part 5-1: Current-carrying capacity tests; Test 5a: Temperature rise (IEC 60512-5-1:2002); German version EN 60512-5-1:2002
Edition 2003-01

Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 13: PQ-cores (IEC 63093-13:2019); German version EN IEC 63093-13:2019
Edition 2019-12

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability (IEC 60749-21:2011); German version EN 60749-21:2011
Edition 2012-01

Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors (IEC 60115-8:2009, modified); German version EN 60115-8:2012
Edition 2013-08

Office machines - Destruction of data carriers - Part 2: Requirements for equipment for destruction of data carriers
Edition 2012-10

Fixed resistors for use in electronic equipment - Part 1: Generic specification (IEC 40/2662/CDV:2019); Text in German and English
Edition 2020-05

Soft soldering fluxes - Test methods - Part 17: Surface insulation resistance comb test and electrochemical migration test of flux residues (ISO 9455-17:2024); German version EN ISO 9455-17:2024
Edition 2024-04